Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449365 | Wafer-level flipchip package with IC circuit isolation | Arya Behzad, Matthew Kaufmann, Jacob Rael, Henry Chen | 2008-11-11 |
MM
Malcolm MacIntosh
Overall (All Time): #3,369,851 of 4,157,543Top 85%
1
Patents All Time