Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7449365 | Wafer-level flipchip package with IC circuit isolation | Arya Behzad, Matthew Kaufmann, Jacob Rael, Henry Chen | 2008-11-11 | $3,508,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7449365 | Wafer-level flipchip package with IC circuit isolation | Arya Behzad, Matthew Kaufmann, Jacob Rael, Henry Chen | 2008-11-11 | $3,508,000 |