Issued Patents All Time
Showing 26–50 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406793 | Semiconductor device with a vertical channel formed through a plurality of semiconductor layers | Frank Hui | 2016-08-02 |
| 9406636 | Interposer package-on-package structure | Rezaur Rahman Khan | 2016-08-02 |
| 9390993 | Semiconductor border protection sealant | Galen Kirkpatrick, Edward Law, Reza-ur Rahman Khan, Ming Wang Sze | 2016-07-12 |
| 9318785 | Apparatus for reconfiguring an integrated waveguide | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2016-04-19 |
| 9299634 | Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages | Rezaur Rahman Khan | 2016-03-29 |
| 9293393 | Stacked packaging using reconstituted wafers | Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen | 2016-03-22 |
| 9286121 | Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2016-03-15 |
| 9275976 | System-in-package with integrated socket | Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-01 |
| 9230875 | Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding | Rezaur Rahman Khan | 2016-01-05 |
| 9153507 | Semiconductor package with improved testability | Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2015-10-06 |
| 9129980 | Package 3D interconnection and method of making same | Rezaur Rahman Khan | 2015-09-08 |
| 9075105 | Passive probing of various locations in a wireless enabled integrated circuit (IC) | Jesus Alfonso Castaneda, Arya Behzad, Ahmadreza (Reza) Rofougaran, Michael Boers | 2015-07-07 |
| 9070627 | Interposer package-on-package structure | Rezaur Rahman Khan | 2015-06-30 |
| 9064781 | Package 3D interconnection and method of making same | Rezaur Rahman Khan | 2015-06-23 |
| 9059179 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2015-06-16 |
| 9046576 | Identifying defective components on a wafer using component triangulation | Arya Behzad, Ahmadreza (Reza) Rofougaran, Jesus Alfonso Castaneda, Michael Boers | 2015-06-02 |
| 9041192 | Hybrid thermal interface material for IC packages with integrated heat spreader | Seyed Mahdi Saeidi | 2015-05-26 |
| 9041171 | Programmable interposer with conductive particles | Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2015-05-26 |
| 9031506 | System having co-located functional resources and applications thereof | Jesus Alfonso Castaneda, Arya Behzad, Michael Boers, Ahmadreza (Reza) Rofougaran | 2015-05-12 |
| 9024436 | Thermal interface material for integrated circuit package | Arpit Mittal, Rezaur Rahman Khan | 2015-05-05 |
| 9013041 | Semiconductor package with ultra-thin interposer without through-semiconductor vias | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2015-04-21 |
| 9013035 | Thermal improvement for hotspots on dies in integrated circuit packages | Rezaur Rahman Khan | 2015-04-21 |
| 9008589 | Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2015-04-14 |
| 9002673 | Simultaneous testing of semiconductor components on a wafer | Arya Behzad, Ahmadreza (Reza) Rofougaran, Jesus Alfonso Castaneda, Michael Boers | 2015-04-07 |
| 8995931 | Creating a system on the fly and applications thereof | Ahmadreza (Reza) Rofougaran, Arya Behzad, Michael Boers, Jesus Alfonso Castaneda | 2015-03-31 |