Issued Patents All Time
Showing 51–75 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8971806 | Wireless bus for intra-chip and inter-chip communication, including scalable wireless bus embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2015-03-03 |
| 8952712 | Tagging of functional blocks of a semiconductor component on a wafer | Arya Behzad, Ahmadreza (Reza) Rofougaran, Jesus Alfonso Castaneda, Michael Boers | 2015-02-10 |
| 8928139 | Device having wirelessly enabled functional blocks | Michael Boers, Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda | 2015-01-06 |
| 8928128 | Semiconductor package with integrated electromagnetic shielding | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2015-01-06 |
| 8923765 | Establishing a wireless communications bus and applications thereof | Arya Behzad, Michael Boers, Jesus Alfonso Castaneda, Ahmadreza (Reza) Rofougaran | 2014-12-30 |
| 8901945 | Test board for use with devices having wirelessly enabled functional blocks and method of using same | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2014-12-02 |
| 8872321 | Semiconductor packages with integrated heat spreaders | Rezaur Rahman Khan, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2014-10-28 |
| 8866502 | Simultaneously tagging of semiconductor components on a wafer | Arya Behzad, Ahmadreza (Reza) Rofougaran, Jesus Alfonso Castaneda, Michael Boers | 2014-10-21 |
| 8829654 | Semiconductor package with interposer | Rezaur Rahman Khan | 2014-09-09 |
| 8829655 | Semiconductor package including a substrate and an interposer | Rezaur Rahman Khan | 2014-09-09 |
| 8829656 | Semiconductor package including interposer with through-semiconductor vias | Rezaur Rahman Khan | 2014-09-09 |
| 8823144 | Semiconductor package with interface substrate having interposer | Rezaur Rahman Khan | 2014-09-02 |
| 8817472 | Methods and systems for on-chip osmotic airflow cooling | Milind S. Bhagavat | 2014-08-26 |
| 8791533 | Semiconductor package having an interposer configured for magnetic signaling | Xiangdong Chen, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2014-07-29 |
| 8749072 | Semiconductor package with integrated selectively conductive film interposer | Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2014-06-10 |
| 8718550 | Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding | Rezaur Rahman Khan | 2014-05-06 |
| 8686558 | Thermally and electrically enhanced ball grid array package | Reza-ur Rahman Khan, Edward Law, Marc Papageorge | 2014-04-01 |
| 8670638 | Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2014-03-11 |
| 8664772 | Interface substrate with interposer | Rezaur Rahman Khan | 2014-03-04 |
| 8587132 | Semiconductor package including an organic substrate and interposer having through-semiconductor vias | Rezaur Rahman Khan | 2013-11-19 |
| 8581381 | Integrated circuit (IC) package stacking and IC packages formed by same | Rezaur Rahman Khan | 2013-11-12 |
| 8558395 | Organic interface substrate having interposer with through-semiconductor vias | Rezaur Rahman Khan | 2013-10-15 |
| 8508045 | Package 3D interconnection and method of making same | Rezaur Rahman Khan | 2013-08-13 |
| 8508029 | Semiconductor package including an integrated waveguide | Michael Boers, Arya Behzad, Ahmadreza (Reza) Rofougaran, Jesus Alfonso Castaneda | 2013-08-13 |
| 8484395 | System and method for dynamically configuring processing resources and memory resources of wireless-enabled components | Michael Boers, Arya Behzad, Jesus Alfonso Castaneda, Ahmadreza (Reza) Rofougaran | 2013-07-09 |