Issued Patents All Time
Showing 101–121 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7462933 | Ball grid array package enhanced with a thermal and electrical connector | Rezaur Rahman Khan | 2008-12-09 |
| 7432586 | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages | Reza-ur Rahman Khan | 2008-10-07 |
| 7402906 | Enhanced die-down ball grid array and method for making the same | Reza-ur Rahman Khan | 2008-07-22 |
| 7271479 | Flip chip package including a non-planar heat spreader and method of making the same | Reza-ur Rahman Khan | 2007-09-18 |
| 7245500 | Ball grid array package with stepped stiffener layer | Reza-ur Rahman Khan | 2007-07-17 |
| 7241645 | Method for assembling a ball grid array package with multiple interposers | Reza-ur Rahman Khan | 2007-07-10 |
| 7227256 | Die-up ball grid array package with printed circuit board attachable heat spreader | Reza-ur Rahman Khan | 2007-06-05 |
| 7202559 | Method of assembling a ball grid array package with patterned stiffener layer | Rezaur Rahman Khan | 2007-04-10 |
| 7161239 | Ball grid array package enhanced with a thermal and electrical connector | Reza-ur Rahman Khan | 2007-01-09 |
| 7132744 | Enhanced die-up ball grid array packages and method for making the same | Reza-ur Rahman Khan | 2006-11-07 |
| 7102225 | Die-up ball grid array package with printed circuit board attachable heat spreader | Reza-ur Rahman Khan, Brent Bacher | 2006-09-05 |
| 7078806 | IC die support structures for ball grid array package fabrication | Reza-ur Rahman Khan | 2006-07-18 |
| 7005737 | Die-up ball grid array package with enhanced stiffener | Reza-ur Rahman Khan | 2006-02-28 |
| 6989593 | Die-up ball grid array package with patterned stiffener opening | Reza-ur Rahman Khan, Brent Bacher | 2006-01-24 |
| 6906414 | Ball grid array package with patterned stiffener layer | Reza-ur Rahman Khan | 2005-06-14 |
| 6887741 | Method for making an enhanced die-up ball grid array package with two substrates | Reza-ur Rahman Khan, Imtiaz Chaudhry | 2005-05-03 |
| 6882042 | Thermally and electrically enhanced ball grid array packaging | Reaz-ur Rahman Khan, Edward Law, Marc Papageorge | 2005-04-19 |
| 6876553 | Enhanced die-up ball grid array package with two substrates | Reza-ur Rahman Khan, Imtiaz Chaudhry | 2005-04-05 |
| 6861750 | Ball grid array package with multiple interposers | Reza-ur Rahman Khan | 2005-03-01 |
| 6853070 | Die-down ball grid array package with die-attached heat spreader and method for making the same | Reza-ur Rahman Khan | 2005-02-08 |
| 6825108 | Ball grid array package fabrication with IC die support structures | Reza-ur Rahman Khan | 2004-11-30 |