Issued Patents All Time
Showing 76–100 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8417861 | Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2013-04-09 |
| 8351855 | Proximity coupling without Ohmic contact and applications thereof | Jesus Alfonso Castaneda, Arya Behzad, Michael Boers, Ahmadreza Rofougaran | 2013-01-08 |
| 8310067 | Ball grid array package enhanced with a thermal and electrical connector | Reza-ur Rahman Khan | 2012-11-13 |
| 8213180 | Electromagnetic interference shield with integrated heat sink | Calvin Gwoon Wong | 2012-07-03 |
| 8183687 | Interposer for die stacking in semiconductor packages and the method of making the same | Rezaur Rahman Khan | 2012-05-22 |
| 8183680 | No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement | Rezaur Rahman Khan | 2012-05-22 |
| 8169067 | Low profile ball grid array (BGA) package with exposed die and method of making same | Edward Law, Rezaur Rahman Khan | 2012-05-01 |
| 8102027 | IC package sacrificial structures for crack propagation confinement | Chonghua Zhong, Rezaur Rahman Khan | 2012-01-24 |
| 8039949 | Ball grid array package having one or more stiffeners | Rezaur Rahman Khan, Edward Law, Marc Papageorge | 2011-10-18 |
| 8021927 | Die down ball grid array packages and method for making same | Reza-ur Rahman Khan | 2011-09-20 |
| 7893546 | Ball grid array package enhanced with a thermal and electrical connector | Reza-ur Rahman Khan | 2011-02-22 |
| 7859101 | Die-up ball grid array package with die-attached heat spreader | Reza-ur Rahman Khan | 2010-12-28 |
| 7808087 | Leadframe IC packages having top and bottom integrated heat spreaders | Rezaur Rahman Khan | 2010-10-05 |
| 7791189 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same | Reza-ur Rahman Khan | 2010-09-07 |
| 7786591 | Die down ball grid array package | Reza-ur Rahman Khan | 2010-08-31 |
| 7781266 | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages | Reza-ur Rahman Khan | 2010-08-24 |
| 7719110 | Flip chip package including a non-planar heat spreader and method of making the same | Reza-ur Rahman Khan | 2010-05-18 |
| 7714453 | Interconnect structure and formation for package stacking of molded plastic area array package | Rezaur Rahman Khan | 2010-05-11 |
| 7646083 | I/O connection scheme for QFN leadframe and package structures | Fan Yeung, Nir Matalon, Victor Fong | 2010-01-12 |
| 7629681 | Ball grid array package with patterned stiffener surface and method of assembling the same | Reza-ur Rahman Khan, Edward Law, Marc Papageorge | 2009-12-08 |
| 7582951 | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages | Reza-ur Rahman Khan | 2009-09-01 |
| 7579217 | Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader | Rezaur Rahman Khan | 2009-08-25 |
| 7566591 | Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features | Reza-ur Rahman Khan | 2009-07-28 |
| 7550845 | Ball grid array package with separated stiffener layer | Reza-ur Rahman Khan | 2009-06-23 |
| 7482686 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same | Reza-ur Rahman Khan | 2009-01-27 |