Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461066 | Structure and method for hybrid optical package with glass top cover | Kumar Nagarajan | 2019-10-29 |
| 9564569 | Hermetic solution for thermal and optical sensor-in-package | Ken Jian Ming Wang, Jerome Chandra Bhat, Tian Tian, Kumar Nagaranjan, Seshasayee Gaddamraja | 2017-02-07 |
| 9355932 | Heat dissipation structure for an integrated circuit (IC) chip | David W. Copeland | 2016-05-31 |
| 9184108 | Heat dissipation structure for an integrated circuit (IC) chip | David W. Copeland | 2015-11-10 |
| 9065025 | Optoelectronic apparatuses with post-molded reflector cups | Lynn K. Wiese | 2015-06-23 |
| 8796052 | Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same | Lynn K. Wiese | 2014-08-05 |
| 8564012 | Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses | Lynn K. Wiese | 2013-10-22 |
| 8558396 | Bond pad configurations for semiconductor dies | Nikhil Vishwanath Kelkar, Sagar Pushpala | 2013-10-15 |
| 8368205 | Metallic thermal joint for high power density chips | Vadim Gektin, James A. Jones, Margaret B. Stern | 2013-02-05 |
| 8331094 | Thermal and power bus stacked package architecture | Vadim Gektin | 2012-12-11 |
| 7449775 | Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion | — | 2008-11-11 |
| 7397664 | Heatspreader for single-device and multi-device modules | — | 2008-07-08 |