Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564569 | Hermetic solution for thermal and optical sensor-in-package | Ken Jian Ming Wang, Jerome Chandra Bhat, Tian Tian, Seshasayee S. Ankireddi, Kumar Nagaranjan | 2017-02-07 |
| 9196608 | Method of chip positioning for multi-chip packaging | Sally Foong, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul | 2015-11-24 |
| 9136258 | Stacked LED for optical sensor devices | Ken Jian Ming Wang, Kumar Nagarajan | 2015-09-15 |
| 8901756 | Chip positioning in multi-chip package | Sally Foong, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul | 2014-12-02 |