TB

Teoh Lai Beng

Cypress Semiconductor: 1 patents #1,072 of 1,852Top 60%
SL Spansion Llc.: 1 patents #435 of 769Top 60%
Overall (All Time): #2,039,904 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9196608 Method of chip positioning for multi-chip packaging Sally Foong, Seshasayee Gaddamraja, Lai Nguk Chin, Suthakavatin Aungkul 2015-11-24
8901756 Chip positioning in multi-chip package Sally Foong, Seshasayee Gaddamraja, Lai Nguk Chin, Suthakavatin Aungkul 2014-12-02