Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679831 | Tape chip on lead using paste die attach material | Paphat Phaoharuhan, Sally Foong | 2017-06-13 |
| 9196608 | Method of chip positioning for multi-chip packaging | Sally Foong, Seshasayee Gaddamraja, Teoh Lai Beng, Suthakavatin Aungkul | 2015-11-24 |
| 8901756 | Chip positioning in multi-chip package | Sally Foong, Seshasayee Gaddamraja, Teoh Lai Beng, Suthakavatin Aungkul | 2014-12-02 |
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Foong Yue Ho, Wong Kwet Nam, Thor Lee Lee, Sally Foong, Kevin Guan | 2014-03-25 |
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Foong Yue Ho, Wong Kwet Nam, Koo Eng Luon, Sally Foong, Kevin Guan | 2013-01-22 |
| 7932131 | Reduction of package height in a stacked die configuration | Sally Foong, Kevin Guan, Changhak Lee, Royce Yeoh Kao Tziat, Foong Yue Ho | 2011-04-26 |