Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Sally Foong, Kevin Guan | 2013-01-22 |