Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Lai Nguk Chin, Wong Kwet Nam, Thor Lee Lee, Sally Foong, Kevin Guan | 2014-03-25 |
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Lai Nguk Chin, Wong Kwet Nam, Koo Eng Luon, Sally Foong, Kevin Guan | 2013-01-22 |
| 7932131 | Reduction of package height in a stacked die configuration | Sally Foong, Kevin Guan, Changhak Lee, Lai Nguk Chin, Royce Yeoh Kao Tziat | 2011-04-26 |