Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Lai Nguk Chin, Foong Yue Ho, Thor Lee Lee, Sally Foong, Kevin Guan | 2014-03-25 |
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Lai Nguk Chin, Foong Yue Ho, Koo Eng Luon, Sally Foong, Kevin Guan | 2013-01-22 |
| 7799612 | Process applying die attach film to singulated die | Sally Foong, Tan Kiah Ling, Kee Cheng Sim, Yue Ho Foong | 2010-09-21 |
| 7157376 | Method and apparatus for handling thin semiconductor wafers | Sally Foong, Lim See-Kee | 2007-01-02 |