Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Thor Lee Lee, Sally Foong | 2014-03-25 |
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Koo Eng Luon, Sally Foong | 2013-01-22 |
| 7932131 | Reduction of package height in a stacked die configuration | Sally Foong, Changhak Lee, Lai Nguk Chin, Royce Yeoh Kao Tziat, Foong Yue Ho | 2011-04-26 |
| 7750481 | Die offset die to die bonding | Nguk Chin Lai, Kwet Nam Wong, Cheng Sim Kee, Sally Foong | 2010-07-06 |
| 7674653 | Die offset die to bonding | Nguk Chin Lai, Kwet Nam Wong, Cheng Sim Kee, Sally Foong | 2010-03-09 |
| 7554204 | Die offset die to die bonding | Nguk Chin Lai, Kwet Nam Wong, Cheng Sim Kee, Sally Foong | 2009-06-30 |