Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546936 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Pakhorudin Hussin, Murugasan Manikam Achari, Tee-Eu Jin | 2013-10-01 |
| 7759171 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Pakhorudin Hussin, Murugasan Manikam Achari, Tee-Eu Jin | 2010-07-20 |
| 7750481 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Cheng Sim Kee, Sally Foong | 2010-07-06 |
| 7674653 | Die offset die to bonding | Nguk Chin Lai, Kevin Guan, Cheng Sim Kee, Sally Foong | 2010-03-09 |
| 7554204 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Cheng Sim Kee, Sally Foong | 2009-06-30 |