Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8586413 | Multi-chip module having a support structure and method of manufacture | Yin Lye Foong, Lay Hong Lee, Mohamed Suhaizal Bin Abu-Hassan | 2013-11-19 |
| 7750481 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Sally Foong | 2010-07-06 |
| 7674653 | Die offset die to bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Sally Foong | 2010-03-09 |
| 7554204 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Sally Foong | 2009-06-30 |