Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679831 | Tape chip on lead using paste die attach material | Lai Nguk Chin, Paphat Phaoharuhan | 2017-06-13 |
| 9431364 | Multi-chip package assembly with improved bond wire separation | Kiah Ling Tan, Lee Changhak, Chin Nguk Lai | 2016-08-30 |
| 9196608 | Method of chip positioning for multi-chip packaging | Seshasayee Gaddamraja, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul | 2015-11-24 |
| 8901756 | Chip positioning in multi-chip package | Seshasayee Gaddamraja, Teoh Lai Beng, Lai Nguk Chin, Suthakavatin Aungkul | 2014-12-02 |
| 8791007 | Device having multiple wire bonds for a bond area and methods thereof | Gin Ghee Tan, Lai Beng Teoh, Royce Yeoh Kao Tziat | 2014-07-29 |
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Thor Lee Lee, Kevin Guan | 2014-03-25 |
| 8357563 | Stitch bump stacking design for overall package size reduction for multiple stack | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Koo Eng Luon, Kevin Guan | 2013-01-22 |
| 7932131 | Reduction of package height in a stacked die configuration | Kevin Guan, Changhak Lee, Lai Nguk Chin, Royce Yeoh Kao Tziat, Foong Yue Ho | 2011-04-26 |
| 7799612 | Process applying die attach film to singulated die | Tan Kiah Ling, Kee Cheng Sim, Wong Kwet Nam, Yue Ho Foong | 2010-09-21 |
| 7750481 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Cheng Sim Kee | 2010-07-06 |
| 7674653 | Die offset die to bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Cheng Sim Kee | 2010-03-09 |
| 7554204 | Die offset die to die bonding | Nguk Chin Lai, Kevin Guan, Kwet Nam Wong, Cheng Sim Kee | 2009-06-30 |
| 7157376 | Method and apparatus for handling thin semiconductor wafers | Lim See-Kee, Wong Kwet Nam | 2007-01-02 |
| 6547121 | Mechanical clamper for heated substrates at die attach | Kok Khoon Ho | 2003-04-15 |
| 6383843 | Using removable spacers to ensure adequate bondline thickness | Kok Khoon Ho | 2002-05-07 |
| 6344161 | Device encapsulation process utilizing pre-cut slots in flexible film substrate | L. K. Suresh, Kanchit Suphanpeasat | 2002-02-05 |
| 6337225 | Method of making stacked die assemblies and modules | Donald Bottarini | 2002-01-08 |