Patents per Year
Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12166001 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2024-12-10 | $68,353,000 |
| 11171099 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2021-11-09 | $43,930,000 |
| 10410988 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2019-09-10 | $26,831,000 |
| 9899285 | Semiconductor device and method of forming small Z semiconductor package | Satyamoorthi Chinnusamy | 2018-02-20 | $7,745,000 |
| 9875988 | Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars | Satyamoorthi Chinnusamy, Weng Hing Tan, Andrew Pan | 2018-01-23 | $15,442,000 |
| 9601461 | Semiconductor device and method of forming inverted pyramid cavity semiconductor package | Satyamoorthi Chinnusamy | 2017-03-21 | $6,378,000 |
| 6547121 | Mechanical clamper for heated substrates at die attach | Sally Foong | 2003-04-15 | $2,272,000 |
| 6383843 | Using removable spacers to ensure adequate bondline thickness | Sally Foong | 2002-05-07 | $2,110,000 |