Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166001 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2024-12-10 |
| 11171099 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2021-11-09 |
| 10410988 | Single-shot encapsulation | Jonathan Clark, John MacLeod | 2019-09-10 |
| 9899285 | Semiconductor device and method of forming small Z semiconductor package | Satyamoorthi Chinnusamy | 2018-02-20 |
| 9875988 | Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars | Satyamoorthi Chinnusamy, Weng Hing Tan, Andrew Pan | 2018-01-23 |
| 9601461 | Semiconductor device and method of forming inverted pyramid cavity semiconductor package | Satyamoorthi Chinnusamy | 2017-03-21 |
| 6547121 | Mechanical clamper for heated substrates at die attach | Sally Foong | 2003-04-15 |
| 6383843 | Using removable spacers to ensure adequate bondline thickness | Sally Foong | 2002-05-07 |