Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9875988 | Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars | Satyamoorthi Chinnusamy, Andrew Pan, Kok Khoon Ho | 2018-01-23 | $15,442,000 |