Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8791007 | Device having multiple wire bonds for a bond area and methods thereof | Gin Ghee Tan, Lai Beng Teoh, Sally Foong | 2014-07-29 |
| 7932131 | Reduction of package height in a stacked die configuration | Sally Foong, Kevin Guan, Changhak Lee, Lai Nguk Chin, Foong Yue Ho | 2011-04-26 |