Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8680686 | Method and system for thin multi chip stack package with film on wire and copper wire | Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Sally Foong, Kevin Guan | 2014-03-25 |