Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546936 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Murugasan Manikam Achari, Tee-Eu Jin, Kwet Nam Wong | 2013-10-01 |
| 7759171 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Murugasan Manikam Achari, Tee-Eu Jin, Kwet Nam Wong | 2010-07-20 |