Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546936 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Pakhorudin Hussin, Tee-Eu Jin, Kwet Nam Wong | 2013-10-01 |
| 7846771 | Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices | Koji Taya, Kouichi Meguro, Junichi Kasai, Yasuhiro Shinma, Masanori Onodera +1 more | 2010-12-07 |
| 7759171 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package | Pakhorudin Hussin, Tee-Eu Jin, Kwet Nam Wong | 2010-07-20 |
| 7414305 | Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices | Koji Taya, Kouichi Meguro, Junichi Kasai, Yasuhiro Shinma, Masanori Onodera +1 more | 2008-08-19 |