Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347733 | Die separation ring for wafers having a large die aspect ratio | Shuo Li, Xiangyang Liu, Xiaodong Liu, Xuri Xin, Zhenghao Wu +1 more | 2025-07-01 |
| 12062625 | Semiconductor device package mold flow control system and method | Hope Chiu, Hua Tan, Kent Yang, Jerry Tang, Simon Dong +2 more | 2024-08-13 |
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Elley Zhang, Cong Zhang, Simon Dong +2 more | 2024-03-26 |
| 10607955 | Heterogeneous fan-out structures for memory devices | Chin-Tien Chiu, Chih-Chin Liao, Hem Takiar | 2020-03-31 |