Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12062625 | Semiconductor device package mold flow control system and method | Hope Chiu, Hua Tan, Kent Yang, Weiting Jiang, Jerry Tang +2 more | 2024-08-13 | |
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Weiting Jiang, Elley Zhang, Cong Zhang +2 more | 2024-03-26 | $10,682,000 |