Issued Patents All Time
Showing 51–53 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6399417 | Method of fabricating plated circuit lines over ball grid array substrate | Wen-Cheng Lee | 2002-06-04 |
| 6391666 | Method for identifying defective elements in array molding of semiconductor packaging | Ya-Hui Huang, Tzong-Dar Her | 2002-05-21 |
| 6392425 | Multi-chip packaging having non-sticking test structure | April Chen, Tzong-Dar Her | 2002-05-21 |