Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6507098 | Multi-chip packaging structure | Randy H. Y. Lo | 2003-01-14 |
| 6495910 | Package structure for accommodating thicker semiconductor unit | — | 2002-12-17 |
| 6472743 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chih Chan, Ming-Chih Hsieh | 2002-10-29 |
| 6455355 | Method of mounting an exposed-pad type of semiconductor device over a printed circuit board | Chieh-Yuan Lin, Jui-Yi Chuang | 2002-09-24 |
| 6414384 | Package structure stacking chips on front surface and back surface of substrate | Randy Lo, Chien-Ping Huang | 2002-07-02 |
| 6353256 | IC package structure for achieving better heat dissipation | — | 2002-03-05 |
| 6281047 | Method of singulating a batch of integrated circuit package units constructed on a single matrix base | Chien-Ping Huang | 2001-08-28 |
| 6281578 | Multi-chip module package structure | Randy H. Y. Lo, Han-Ping Pu, Eric Ko | 2001-08-28 |
| 6282096 | Integration of heat conducting apparatus and chip carrier in IC package | Randy H. Y. Lo | 2001-08-28 |
| 6242283 | Wafer level packaging process of semiconductor | Randy H. Y. Lo | 2001-06-05 |