Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8361843 | Method for fabricating heat dissipation package structure | Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao | 2013-01-29 |
| 8013436 | Heat dissipation package structure and method for fabricating the same | Yo-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-09-06 |