Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387993 | Electronic package and manufacturing method thereof | Tai-Shin Renn, Kuo-Hua Yu, Wei-Shen Hung | 2025-08-12 |
| 12132003 | Electronic package and manufacturing method thereof | You-Chen Lin, Kuo-Hua Yu, Jun FENG | 2024-10-29 |
| 10763237 | Method for manufacturing electronic package | Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang | 2020-09-01 |
| 10522500 | Method for manufacturing electronic package | Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang | 2019-12-31 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Han-Hung Chen, Chang-Fu Lin, Fu-Tang Huang | 2019-07-23 |