Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400931 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2025-08-26 |
| 12387993 | Electronic package and manufacturing method thereof | Tai-Shin Renn, Yu-Min Lo, Wei-Shen Hung | 2025-08-12 |
| 12278189 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2025-04-15 |
| 12132003 | Electronic package and manufacturing method thereof | You-Chen Lin, Yu-Min Lo, Jun FENG | 2024-10-29 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Yu-Lung Huang, Chang-Fu Lin | 2024-09-03 |
| 11984379 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2024-05-14 |
| 11810862 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2023-11-07 |
| 11605554 | Flip-chip process and bonding equipment | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2023-03-14 |
| 11521930 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2022-12-06 |
| 11380978 | Electronic package and method for fabricating the same | Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Chang-Fu Lin | 2022-07-05 |
| 11289794 | Electronic package | Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Chang-Fu Lin | 2022-03-29 |
| 11101566 | Method for fabricating electronic package | Han-Hung Chen, Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin | 2021-08-24 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |
| 10763237 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Hsiang-Hua Huang | 2020-09-01 |
| 10756438 | Electronic package and method for fabricating the same | Han-Hung Chen, Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin | 2020-08-25 |
| 10522500 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Hsiang-Hua Huang | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chang-Fu Lin, Chin-Tsai Yao, Fu-Tang Huang | 2019-12-17 |
| 8284838 | Apparatus and related method for decoding video blocks in video pictures | Jin-Sheng Gong, Yu-Teng Lin, Hsiao-Jen Weng, Kun Wang | 2012-10-09 |
| 6709741 | FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler | Fu-Le Lin, Ching Chen, Tzu-Ching Hung, Sung-Chen Huang, Kuo-Hsiung Hsia +1 more | 2004-03-23 |