Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7701069 | Solder interface locking using unidirectional growth of an intermetallic compound | Siew Fong Tai, Chee-Key Chung | 2010-04-20 | $20,991,000 |
| 7692301 | Stitched micro-via to enhance adhesion and mechanical strength | Chee-Key Chung, Kian Sin Sim | 2010-04-06 | $11,081,000 |
| 7229913 | Stitched micro-via to enhance adhesion and mechanical strength | Chee-Key Chung, Kian Sin Sim | 2007-06-12 | $15,149,000 |
| 6828512 | Apparatus and methods for interconnecting components to via-in-pad interconnects | C. K. Chung, Sook Chien Chan | 2004-12-07 | $37,431,000 |