Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9130064 | Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier | Chang-Yueh Chan, Chih-Ming Huang, Chun-Yuan Li | 2015-09-08 |
| 8618641 | Leadframe-based semiconductor package | Chang-Yueh Chan, Chih-Ming Huang, Chun-Yuan Li | 2013-12-31 |