Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455159 | Fabrication method of packaging substrate | Wei Wang, Pang-Chun Lin, Chin-Chih Hsiao, Kuan-I Cheng | 2016-09-27 |
| 9171741 | Packaging substrate and fabrication method thereof | Wei Wang, Pang-Chun Lin, Chin-Chih Hsiao, Kaun-I Cheng | 2015-10-27 |