Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394636 | Method for fabricating electronic package | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2025-08-19 |
| 12033868 | Electronic package and method for fabricating the same | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2024-07-09 |
| 11728178 | Method for fabricating electronic package | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2023-08-15 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai +2 more | 2021-03-16 |
| 10903088 | Electronic package and method for fabricating the same | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2021-01-26 |
| 10396040 | Method for fabricating electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, En-Li Lin, Yu-De Chu | 2019-08-27 |
| 9997469 | Electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, En-Li Lin, Yu-De Chu | 2018-06-12 |
| 9171741 | Packaging substrate and fabrication method thereof | Wei Wang, Pang-Chun Lin, Chin-Chih Hsiao, Cheng-Wen Chiu | 2015-10-27 |