Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396040 | Method for fabricating electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, En-Li Lin, Kaun-I Cheng | 2019-08-27 |
| 9997469 | Electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, En-Li Lin, Kaun-I Cheng | 2018-06-12 |