Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318354 | Semiconductor package and fabrication method thereof | Pang-Chun Lin | 2016-04-19 |
| 6928735 | Method of vehicle door assembly | David Malik, Hamid G. Kia, Lei Zhang, Li Yu, Dexin Wang +2 more | 2005-08-16 |