Issued Patents All Time
Showing 26–50 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8564115 | Package structure having micro-electromechanical element | Chang-Yueh Chan, Chun-Chi Ke, Chun-An Huang, Chih-Ming Huang | 2013-10-22 |
| 8546183 | Method for fabricating heat dissipating semiconductor package | Chih-Ming Huang | 2013-10-01 |
| 8525348 | Chip scale package and fabrication method thereof | Chiang-Cheng Chang, Chun-Chi Ke | 2013-09-03 |
| 8484847 | Method for making a showerhead | Tsan-Hua Huang | 2013-07-16 |
| 8448288 | Semiconductor equipment | Tsan-Hua Huang, Tsung-Hsun HAN | 2013-05-28 |
| 8421199 | Semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chun-Chi Ke | 2013-04-16 |
| 8420452 | Fabrication method of leadframe-based semiconductor package | Han-Ping Pu | 2013-04-16 |
| 8390118 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chun-Chi Ke | 2013-03-05 |
| 8361843 | Method for fabricating heat dissipation package structure | Min-Shun Hung, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2013-01-29 |
| 8304891 | Semiconductor package device, semiconductor package structure, and fabrication methods thereof | Cheng-Chia Chiang, Chin-Huang Chang, Chih-Ming Huang, Jung-Pin Huang | 2012-11-06 |
| 8304268 | Fabrication method of semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chun-Chi Ke | 2012-11-06 |
| 8253248 | Fabrication method of semiconductor device having conductive bumps | Chun-Chi Ke | 2012-08-28 |
| 8241967 | Semiconductor package with a support structure and fabrication method thereof | Fu Tang | 2012-08-14 |
| 8198689 | Package structure having micro-electromechanical element and fabrication method thereof | Chang-Yueh Chan, Chun-Chi Ke, Chun-An Huang, Chih-Ming Huang | 2012-06-12 |
| 8183092 | Method of fabricating stacked semiconductor structure | Chih-Ming Huang, Han-Ping Pu, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-05-22 |
| 8154115 | Package structure having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chun-Chi Ke, Shih-Kuang Chiu | 2012-04-10 |
| 8079539 | Built-in module for inverter and having tension control with integrated tension and velocity closed loops | Cheng-Hsiang Kuo | 2011-12-20 |
| 8062933 | Method for fabricating heat dissipating package structure | Cheng-Hsu Hsiao | 2011-11-22 |
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant | Han-Ping Pu, Cheng-Hsu Hsiao | 2011-11-15 |
| 8026602 | Fabrication method of semiconductor device having conductive bumps | Chun-Chi Ke | 2011-09-27 |
| 8013436 | Heat dissipation package structure and method for fabricating the same | Min-Shun Hung, Yo-Yi Tsai, Cheng-Hsu Hsiao | 2011-09-06 |
| 8013443 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Ho-Yi Tsai, Chih-Ming Huang | 2011-09-06 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Wen-Tsung Tseng, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2011-08-30 |
| RE42653 | Semiconductor package with heat dissipating structure | — | 2011-08-30 |
| 7993967 | Semiconductor package fabrication method | Yih-Jenn Jiang, Han-Ping Pu, Cheng-Hsu Hsiao | 2011-08-09 |