Issued Patents All Time
Showing 76–100 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7608915 | Heat dissipation semiconductor package | Chun-Ming Liao, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2009-10-27 |
| 7521285 | Method for fabricating chip-stacked semiconductor package | — | 2009-04-21 |
| 7508066 | Heat dissipating semiconductor package and fabrication method thereof | Chih-Ming Huang | 2009-03-24 |
| 7445957 | Method for fabricating wafer level semiconductor package with build-up layer | Cheng-Hsu Hsiao, Chih-Ming Huang | 2008-11-04 |
| 7446307 | Sensor semiconductor device and fabrication method of the sensor semiconductor device | Chih-Ming Huang, Cheng-Yi Chang | 2008-11-04 |
| 7443016 | Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant | Yun-Lung Tsai, Yu-Chieh Tsai, Chien-Chih Chen | 2008-10-28 |
| 7423340 | Semiconductor package free of substrate and fabrication method thereof | Yu-Po Wang, Chih-Ming Huang | 2008-09-09 |
| 7410836 | Method for fabricating a photosensitive semiconductor package | — | 2008-08-12 |
| 7371617 | Method for fabricating semiconductor package with heat sink | Ho-Yi Tsai | 2008-05-13 |
| 7365364 | Sensor semiconductor device with sensor chip | Chih-Ming Huang, Cheng-Yi Chang | 2008-04-29 |
| 7364944 | Method for fabricating thermally enhanced semiconductor package | Cheng-Hsu Hsiao | 2008-04-29 |
| 7358177 | Fabrication method of under bump metallurgy structure | Chun-Chi Ke | 2008-04-15 |
| 7355279 | Semiconductor device and fabrication method thereof | Chun-Chi Ke, Kook-Jui Tai | 2008-04-08 |
| 7354796 | Method for fabricating semiconductor package free of substrate | Yu-Po Wang, Chih-Ming Huang | 2008-04-08 |
| 7348211 | Method for fabricating semiconductor packages | Ying-Ren Lin, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2008-03-25 |
| 7342304 | Semiconductor package with heat dissipating structure | — | 2008-03-11 |
| 7342318 | Semiconductor package free of substrate and fabrication method thereof | Yu-Po Wang, Chih-Ming Huang | 2008-03-11 |
| 7337675 | Method for measuring average velocity pressure and system thereof | — | 2008-03-04 |
| 7315078 | Chip-stacked semiconductor package and method for fabricating the same | — | 2008-01-01 |
| RE39957 | Method of making semiconductor package with heat spreader | Tzong-Da Ho, Cheng-Hsu Hsiao | 2007-12-25 |
| 7274088 | Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof | Chi-Chuan Wu, Han-Ping Pu | 2007-09-25 |
| 7271483 | Bump structure of semiconductor package and method for fabricating the same | Ying-Ren Lin, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2007-09-18 |
| 7271024 | Method for fabricating sensor semiconductor device | Chih-Ming Huang, Cheng-Yi Chang | 2007-09-18 |
| 7271493 | Semiconductor package free of substrate and fabrication method thereof | Yu-Po Wang, Chih-Ming Huang | 2007-09-18 |
| 7242068 | Photosensitive semiconductor package, method for fabricating the same, and lead frame thereof | — | 2007-07-10 |