Issued Patents All Time
Showing 126–150 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943439 | Substrate and fabrication method of the same | Han-Ping Pu, Chih-Chin Liao | 2005-09-13 |
| 6891273 | Semiconductor package and fabrication method thereof | Han-Ping Pu | 2005-05-10 |
| 6884652 | Semiconductor package free of substrate and fabrication method thereof | Yu-Po Wang, Chih-Ming Huang | 2005-04-26 |
| 6870274 | Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package | — | 2005-03-22 |
| 6867487 | Flash-preventing semiconductor package | Tzong-Da Ho | 2005-03-15 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chi Chan | 2005-02-22 |
| 6856015 | Semiconductor package with heat sink | Cheng-Hsu Hsiao, Shih-Kuang Chiu | 2005-02-15 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao | 2005-02-01 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan | 2005-01-25 |
| 6844622 | Semiconductor package with heat sink | Tzong-Da Ho, Cheng-Hsu Hsiao | 2005-01-18 |
| 6830957 | Method of fabricating BGA packages | Han-Ping Pu, Chih-Ming Huang | 2004-12-14 |
| 6828665 | Module device of stacked semiconductor packages and method for fabricating the same | Han-Ping Pu, Chih-Ming Huang | 2004-12-07 |
| 6812063 | Semiconductor package and fabricating method thereof | — | 2004-11-02 |
| 6806565 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chin-Yuan Hong, Jui-Hsiang Hung, Chin-Teng Hsu | 2004-10-19 |
| 6787921 | Array structure of solder balls able to control collapse | — | 2004-09-07 |
| 6784019 | Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same | — | 2004-08-31 |
| 6781245 | Array structure of solder balls able to control collapse | — | 2004-08-24 |
| 6777819 | Semiconductor package with flash-proof device | — | 2004-08-17 |
| 6770959 | Semiconductor package without substrate and method of manufacturing same | Raymond Jao | 2004-08-03 |
| 6767753 | Image sensor of a quad flat package | — | 2004-07-27 |
| 6764880 | Semiconductor package and fabricating method thereof | Chi-Chuan Wu | 2004-07-20 |
| D492314 | IC card type circuit module | Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2004-06-29 |
| 6756684 | Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same | — | 2004-06-29 |
| 6753206 | Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same | Lian-Cherng Chiang, Michael Chang | 2004-06-22 |
| 6750533 | Substrate with dam bar structure for smooth flow of encapsulating resin | Yu-Po Wang, Chung-Chi Lin | 2004-06-15 |