Issued Patents All Time
Showing 151–175 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6743706 | Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body | — | 2004-06-01 |
| 6740978 | Chip package capable of reducing moisture penetration | Chih-Chin Liao, Yung-Kang Chu | 2004-05-25 |
| 6720649 | Semiconductor package with heat dissipating structure | — | 2004-04-13 |
| 6713864 | Semiconductor package for enhancing heat dissipation | — | 2004-03-30 |
| 6713321 | Super low profile package with high efficiency of heat dissipation | Tzong-Dar Her | 2004-03-30 |
| 6707167 | Semiconductor package with crack-preventing member | Tzong-Da Ho | 2004-03-16 |
| 6703698 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chih-Ming Huang | 2004-03-09 |
| 6703691 | Quad flat non-leaded semiconductor package and method of fabricating the same | Nan-Jang Chen, Kevin Chiang, Tzong-Da Ho | 2004-03-09 |
| 6700204 | Substrate for accommodating passive component | Chien-Te Chen | 2004-03-02 |
| 6699731 | Substrate of semiconductor package | Tzong-Da Ho, Chen-Hsu Hsiao | 2004-03-02 |
| 6696750 | Semiconductor package with heat dissipating structure | Cha-Yun Yin, Ming-Chun Laio, Fu Tang | 2004-02-24 |
| 6689636 | Semiconductor device and fabrication method of the same | Chih-Chin Liao, Han-Ping Pu | 2004-02-10 |
| 6677665 | Dual-die integrated circuit package | — | 2004-01-13 |
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring | Eric Ko, Chih-Ming Huang | 2003-12-23 |
| 6664649 | Lead-on-chip type of semiconductor package with embedded heat sink | — | 2003-12-16 |
| 6661089 | Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same | — | 2003-12-09 |
| 6657296 | Semicondctor package | Tzong-Da Ho | 2003-12-02 |
| 6650006 | Semiconductor package with stacked chips | Tzong-Da Ho, Cheng-Hsu Hsiao | 2003-11-18 |
| 6650009 | Structure of a multi chip module having stacked chips | Tzong-Dar Her, Randy H. Y. Lo | 2003-11-18 |
| 6646349 | Ball grid array semiconductor package | Han-Ping Pu | 2003-11-11 |
| 6643919 | Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame | — | 2003-11-11 |
| 6639306 | Semiconductor package having a die pad with downward-extended tabs | — | 2003-10-28 |
| 6635209 | Method of encapsulating a substrate-based package assembly without causing mold flash | — | 2003-10-21 |
| 6630729 | Low-profile semiconductor package with strengthening structure | — | 2003-10-07 |
| 6621150 | Lead frame adaptable to the trend of IC packaging | Yvonne Lee, Han-Ping Pu | 2003-09-16 |