Issued Patents All Time
Showing 101–125 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208825 | Stacked semiconductor packages | Han-Ping Pu | 2007-04-24 |
| 7205674 | Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package | Yu-Po Wang | 2007-04-17 |
| 7205642 | Semiconductor package and method for fabricating the same | Yu-Po Wang, Cheng-Hsu Hsiao | 2007-04-17 |
| 7199459 | Semiconductor package without bonding wires and fabrication method thereof | Han-Ping Pu | 2007-04-03 |
| 7196414 | Semiconductor package with heat sink | Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao | 2007-03-27 |
| 7177155 | Semiconductor package with heat sink | Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao | 2007-02-13 |
| 7170152 | Wafer level semiconductor package with build-up layer and method for fabricating the same | Cheng-Hsu Hsiao, Chih-Ming Huang | 2007-01-30 |
| 7164210 | Semiconductor package with heat sink and method for fabricating same | Ho-Yi Tsai | 2007-01-16 |
| 7148561 | Ball grid array substrate strip with warpage-preventive linkage structure | Tzong-Da Ho, Isaac Yu | 2006-12-12 |
| 7132312 | Method for fabricating semiconductor package having conductive bumps on chip | Cheng-Hsu Hsiao | 2006-11-07 |
| 7129119 | Method for fabricating semiconductor packages | Ying-Ren Lin, Ho-Yi Tsai | 2006-10-31 |
| 7127377 | Monitoring systems and methods thereof | Hsin-Dar Tang | 2006-10-24 |
| 7119565 | Chip carrier and method for testing electrical performance of passive component | Chien-Te Chen | 2006-10-10 |
| D529031 | IC card type circuit module | Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2006-09-26 |
| 7102239 | Chip carrier for semiconductor chip | Han-Ping Pu, Chang-Fu Lin | 2006-09-05 |
| 7084474 | Photosensitive semiconductor package and method for fabricating the same | Chia-Yu Hung, Ke Yang | 2006-08-01 |
| 7074645 | Fabrication method of semiconductor package with heat sink | Tzong-Da Ho, Cheng-Hsu Hsiao | 2006-07-11 |
| 7057276 | Semiconductor package with heat sink | Chang-Fu Lin, Han-Ping Pu | 2006-06-06 |
| 7019406 | Thermally enhanced semiconductor package | Cheng-Hsu Hsiao | 2006-03-28 |
| 7008826 | Lead-frame-based semiconductor package and fabrication method thereof | Holman Chen, Chin-Yuan Hong, Jui-Hsiang Hung, Chin-Teng Hsu | 2006-03-07 |
| 7005720 | Semiconductor package with photosensitive chip and fabrication method thereof | Cheng-Hsu Hsiao, Chih-Ming Huang | 2006-02-28 |
| 7002245 | Semiconductor package having conductive bumps on chip and method for fabricating the same | Cheng-Hsu Hsiao | 2006-02-21 |
| 6989296 | Fabrication method of semiconductor package with photosensitive chip | Cheng-Hsu Hsiao, Chih-Ming Huang | 2006-01-24 |
| 6980438 | Semiconductor package with heat dissipating structure | Han-Ping Pu, Chin-Te Chen, Chang-Fu Lin | 2005-12-27 |
| 6972216 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chih-Ming Huang | 2005-12-06 |