Issued Patents All Time
Showing 51–75 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985618 | Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant | Yun-Lung Tsai, Yu-Chieh Tsai, Chien-Chih Chen | 2011-07-26 |
| 7981729 | Fabrication method of multi-chip stack structure | Jung-Pin Huang, Chin-Huang Chang, Chung-Lun Liu, Cheng-Hsu Hsiao | 2011-07-19 |
| 7939383 | Method for fabricating semiconductor package free of substrate | Yu-Po Wang, Chih-Ming Huang | 2011-05-10 |
| 7934313 | Package structure fabrication method | Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chun-Chi Ke | 2011-05-03 |
| 7893547 | Semiconductor package with a support structure and fabrication method thereof | Fu Tang | 2011-02-22 |
| 7884456 | Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant | Yun-Lung Tsai, Yu-Chieh Tsai, Chien-Chih Chen | 2011-02-08 |
| 7863740 | Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof | Chun-Chi Ke | 2011-01-04 |
| 7858446 | Sensor-type semiconductor package and fabrication method thereof | Tse-Wen Chang, Chang-Yueh Chan, Cheng-Yi Chang | 2010-12-28 |
| 7816187 | Method for fabricating semiconductor package free of substrate | Yu-Po Wang, Chih-Ming Huang | 2010-10-19 |
| 7808110 | Semiconductor package substrate | Yu-Po Wang, Wei-Chun Lin, Wen-Cheng Lee | 2010-10-05 |
| 7804173 | Semiconductor device having conductive bumps and deviated solder pad | Chun-Chi Ke | 2010-09-28 |
| 7781264 | Method for fabricating flip-chip semiconductor package with lead frame as chip carrier | Chi-Chuan Wu, Han-Ping Pu | 2010-08-24 |
| 7772685 | Stacked semiconductor structure and fabrication method thereof | Chih-Ming Huang, Han-Ping Pu, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-08-10 |
| 7768106 | Multi-chip stack structure and fabrication method thereof | Jung-Ping Huang, Chin-Huang Chang, Chung-Lun Liu, Cheng-Hsu Hsiao | 2010-08-03 |
| 7759170 | Fabrication method of semiconductor package having heat dissipation device | Han-Ping Pu, Cheng-Hsu Hsiao | 2010-07-20 |
| 7750467 | Chip scale package structure with metal pads exposed from an encapsulant | Han-Ping Pu, Cheng-Hsu Hsiao | 2010-07-06 |
| 7745262 | Heat dissipating package structure and method for fabricating the same | Cheng-Hsu Hsiao | 2010-06-29 |
| 7696623 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Ho-Yi Tsai, Chih-Ming Huang | 2010-04-13 |
| 7679178 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Han-Ping Pu, Chih-Ming Huang, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-03-16 |
| 7679172 | Semiconductor package without chip carrier and fabrication method thereof | Fu Tang, Yuan LI | 2010-03-16 |
| 7671466 | Semiconductor package having heat dissipating device with cooling fluid | Han-Ping Pu, Cheng-Hsu Hsiao | 2010-03-02 |
| 7666779 | Fabrication method of a semiconductor device | Chun-Chi Ke, Kook-Jui Tai | 2010-02-23 |
| 7638879 | Semiconductor package and fabrication method thereof | Yih-Jenn Jiang, Han-Ping Pu, Cheng-Hsu Hsiao | 2009-12-29 |
| 7629199 | Method for fabricating semiconductor package with build-up layers formed on chip | Yu-Po Wang | 2009-12-08 |
| 7615862 | Heat dissipating package structure and method for fabricating the same | Cheng-Hsu Hsiao | 2009-11-10 |