Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754927 | Method for fabricating multi-chip stack structure | Jung-Pin Huang, Yi-Feng Chang, Chin-Huang Chang | 2017-09-05 |
| 8896130 | Multi-chip stack structure and method for fabricating the same | Jung-Pin Huang, Yi-Feng Chang, Chin-Huang Chang | 2014-11-25 |
| 7981729 | Fabrication method of multi-chip stack structure | Jung-Pin Huang, Chin-Huang Chang, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-07-19 |
| 7768106 | Multi-chip stack structure and fabrication method thereof | Jung-Ping Huang, Chin-Huang Chang, Chien-Ping Huang, Cheng-Hsu Hsiao | 2010-08-03 |
| 7655503 | Method for fabricating semiconductor package with stacked chips | Jung-Pin Huang, Chin-Huang Chang | 2010-02-02 |
| 7266888 | Method for fabricating a warpage-preventive circuit board | Chin-Huang Chang, Chin-Tien Chiu | 2007-09-11 |
| 7193309 | Semiconductor package with stacked chips and method for fabricating the same | Jung-Pin Huang, Chin-Huang Chang | 2007-03-20 |
| 6919627 | Multichip module | Chin-Huang Chang | 2005-07-19 |
| 6864434 | Warpage-preventive circuit board and method for fabricating the same | Chin-Huang Chang, Chin-Tien Chiu | 2005-03-08 |