Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10080179 | Method for verifying operation in wireless control system | Chung-Chin Huang, Chin-Ying Huang, Hsin-Ming Huang, Hsing-Hsiung Huang, Yen-Jen Yeh | 2018-09-18 |
| 9754927 | Method for fabricating multi-chip stack structure | Chung-Lun Liu, Jung-Pin Huang, Yi-Feng Chang | 2017-09-05 |
| 8896130 | Multi-chip stack structure and method for fabricating the same | Chung-Lun Liu, Jung-Pin Huang, Yi-Feng Chang | 2014-11-25 |
| 8802507 | Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure | Cheng-Chia Chiang, Chien-Ping Huang, Chih-Ming Huang, Jung-Pin Huang | 2014-08-12 |
| 8304891 | Semiconductor package device, semiconductor package structure, and fabrication methods thereof | Cheng-Chia Chiang, Chien-Ping Huang, Chih-Ming Huang, Jung-Pin Huang | 2012-11-06 |
| 7981729 | Fabrication method of multi-chip stack structure | Jung-Pin Huang, Chien-Ping Huang, Chung-Lun Liu, Cheng-Hsu Hsiao | 2011-07-19 |
| 7768106 | Multi-chip stack structure and fabrication method thereof | Jung-Ping Huang, Chien-Ping Huang, Chung-Lun Liu, Cheng-Hsu Hsiao | 2010-08-03 |
| 7655503 | Method for fabricating semiconductor package with stacked chips | Jung-Pin Huang, Chung-Lun Liu | 2010-02-02 |
| 7339199 | Semiconductor package including light emitter and IC | Wei Lu, Cheng-Jen Liu, Yi-Feng Chang | 2008-03-04 |
| 7266888 | Method for fabricating a warpage-preventive circuit board | Chin-Tien Chiu, Chung-Lun Liu | 2007-09-11 |
| 7205485 | Printed circuit board and method for fabricating the same | Chin-Tien Chiu, Chih-Ming Huang | 2007-04-17 |
| 7193309 | Semiconductor package with stacked chips and method for fabricating the same | Jung-Pin Huang, Chung-Lun Liu | 2007-03-20 |
| 6963135 | Semiconductor package for memory chips | Cheng-Chian Chiang, Chih-Ming Huang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2005-11-08 |
| 6919627 | Multichip module | Chung-Lun Liu | 2005-07-19 |
| 6864434 | Warpage-preventive circuit board and method for fabricating the same | Chin-Tien Chiu, Chung-Lun Liu | 2005-03-08 |
| 6835897 | Warpage preventing substrate | Chin-Tien Chiu, Cheng-Lun Liu | 2004-12-28 |
| D498760 | Digital memory card | Cheng-Chia Chiang, Chih-Ming Huang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2004-11-23 |
| D493799 | Digital memory card | Cheng-Chia Chiang, Chih-Ming Huang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2004-08-03 |
| 6737737 | Semiconductor package with chip supporting member | Chin-Tien Chiu, Jung-Pin Huang | 2004-05-18 |
| 6720270 | Method for reducing size of semiconductor unit in packaging process | — | 2004-04-13 |