Issued Patents All Time
Showing 176–200 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Tzong-Dar Her, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6593658 | Chip package capable of reducing moisture penetration | Chih-Chin Liao, Yung-Kang Chu | 2003-07-15 |
| 6590281 | Crack-preventive semiconductor package | Chi-Chuan Wu | 2003-07-08 |
| 6583499 | Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package | Tzong-Dar Her | 2003-06-24 |
| 6570249 | Semiconductor package | Chih-Chin Liao, Han-Ping Pu | 2003-05-27 |
| 6559525 | Semiconductor package having heat sink at the outer surface | — | 2003-05-06 |
| 6555902 | Multiple stacked-chip packaging structure | Randy H. Y. Lo, Chi-Chuan Wu | 2003-04-29 |
| 6552428 | Semiconductor package having an exposed heat spreader | Tom Tang, Kevin Chiang, Jenq-Yuan Lai, Candy Tien, Vicky Liu | 2003-04-22 |
| 6548911 | Multimedia chip package | Kevin Yu, Che-Jung Chang | 2003-04-15 |
| 6543128 | Ball grid array package and its fabricating process | Grace Yang | 2003-04-08 |
| 6545332 | Image sensor of a quad flat package | — | 2003-04-08 |
| 6541307 | Multimedia chip package | Kevin Yu, Che-Jung Chang | 2003-04-01 |
| 6541870 | Semiconductor package with stacked chips | Tzong-Da Ho, Cheng-Hsu Hsiao | 2003-04-01 |
| 6541854 | Super low profile package with high efficiency of heat dissipation | Tzong-Dar Her | 2003-04-01 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chi Chan | 2003-03-25 |
| 6528876 | Semiconductor package having heat sink attached to substrate | — | 2003-03-04 |
| 6528722 | Ball grid array semiconductor package with exposed base layer | Randy H. Y. Lo | 2003-03-04 |
| 6525942 | Heat dissipation ball grid array package | Tzong-Dar Her | 2003-02-25 |
| 6521997 | Chip carrier for accommodating passive component | Wei-Chen Tseng, Yu-Ting Lai | 2003-02-18 |
| 6507104 | Semiconductor package with embedded heat-dissipating device | Tzong-Da Ho | 2003-01-14 |
| 6507121 | Array structure of solder balls able to control collapse | — | 2003-01-14 |
| 6498391 | Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same | Lian-Cherng Chiang, Michael Chang | 2002-12-24 |
| 6483039 | Substrate of semiconductor package | Tzong-Da Ho, Chen-Hsu Hsiao | 2002-11-19 |
| 6479894 | Layout method for thin and fine ball grid array package substrate with plating bus | Tzong-Da Ho | 2002-11-12 |
| 6472743 | Semiconductor package with heat dissipating structure | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chih Chan, Ming-Chih Hsieh | 2002-10-29 |