Issued Patents All Time
Showing 226–244 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6319750 | Layout method for thin and fine ball grid array package substrate with plating bus | Tzong-Da Ho | 2001-11-20 |
| 6309914 | Method for making a semiconductor package | Chun-Chi Ke | 2001-10-30 |
| 6306682 | Method of fabricating a ball grid array integrated circuit package having an encapsulating body | Randy H. Y. Lo, Tzong-Da Ho, Eric Ko, Jui-Meng Jao | 2001-10-23 |
| 6307257 | Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads | Lian-Cherng Chiang, Wen-Ta Tsai | 2001-10-23 |
| 6290481 | Flash-free mold structure for integrated circuit package | — | 2001-09-18 |
| 6291263 | Method of fabricating an integrated circuit package having a core-hollowed encapsulation body | — | 2001-09-18 |
| 6291260 | Crack-preventive substrate and process for fabricating solder mask | April Chen, Tzong-Dar Her | 2001-09-18 |
| 6281047 | Method of singulating a batch of integrated circuit package units constructed on a single matrix base | Chi-Chuan Wu | 2001-08-28 |
| 6271581 | Semiconductor package structure having universal lead frame and heat sink | Wei-Chen Tseng | 2001-08-07 |
| 6249433 | Heat-dissipating device for integrated circuit package | Jui-Meng Jao | 2001-06-19 |
| 6246115 | Semiconductor package having a heat sink with an exposed surface | Tom Tang, Kevin Chiang, Jeng-Yuan Lai, Candy Tien, Vicky Liu | 2001-06-12 |
| 6246111 | Universal lead frame type of quad flat non-lead package of semiconductor | Eric Ko | 2001-06-12 |
| 6236568 | Heat-dissipating structure for integrated circuit package | Jeng-Yuan Lai | 2001-05-22 |
| 6218731 | Tiny ball grid array package | Tzong-Dar Her, Kevin Chiang | 2001-04-17 |
| 6198171 | Thermally enhanced quad flat non-lead package of semiconductor | Eric Ko | 2001-03-06 |
| 6191490 | Semiconductor package having a separated die pad | — | 2001-02-20 |
| 6083775 | Method of encapsulating a chip | Yang Huang, Kevin Yu, Sheng-Fang Chen | 2000-07-04 |
| 5961912 | Encapsulating method of substrate based electronic device | Kevin Yu, Chih-Ming Huang | 1999-10-05 |
| 5796162 | Frames locking method for packaging semiconductor chip | — | 1998-08-18 |