Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10028380 | Semiconductor package with dual second level electrical interconnections | Abhishek Ramesh Tambat, Elad Baram, Pradip Ghimire | 2018-07-17 |
| 8817511 | PCB circuit modification from multiple to individual chip enable signals | Michael James McCarthy, Ning Ye | 2014-08-26 |
| 8637779 | Electronic component including micro balls | Suresh Upadhyayula | 2014-01-28 |
| 7778057 | PCB circuit modification from multiple to individual chip enable signals | Michael James McCarthy, Ning Ye | 2010-08-17 |
| 7709278 | Method of making PCB circuit modification from multiple to individual chip enable signals | Michael James McCarthy, Ning Ye | 2010-05-04 |