Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Yuyun Lou, Junrong Yan | 2024-02-13 |
| 11894343 | Vertical semiconductor device with side grooves | Xianlu Cui, Junrong Yan, Wei Liu | 2024-02-06 |
| 11756932 | Sloped interconnector for stacked die package | Xianlu Cui, Junrong Yan, CheeKeong Chin | 2023-09-12 |