Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083715 | Mold compound dispensing system and method | Junrong Yan, C K Chin, Tao Shi | 2024-09-10 |
| 11894343 | Vertical semiconductor device with side grooves | Junrong Yan, Wei Liu, Zhonghua Qian | 2024-02-06 |
| 11756932 | Sloped interconnector for stacked die package | Junrong Yan, CheeKeong Chin, Zhonghua Qian | 2023-09-12 |