Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8212360 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Jack Chang Chien, Cheemen Yu, Hem Takiar | 2012-07-03 |
| 8129272 | Hidden plating traces | Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Han-Shiao Chen, Chih-Chin Liao | 2012-03-06 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Jack Chang Chien, Shrikar Bhagath +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-10 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Jack Chang Chien, Cheeman Yu, Hem Takiar | 2011-05-10 |
| 7806731 | Rounded contact fingers on substrate/PCB for crack prevention | Hem Takiar, Cheemen Yu, Ken Jian Ming Wang, Han-Shiao Chen, Chih-Chin Liao | 2010-10-05 |
| 7772047 | Method of fabricating a semiconductor die having a redistribution layer | Chien-Ko Liao, Jack Chang Chien, Cheemen Yu, Hem Takiar | 2010-08-10 |
| 7763980 | Semiconductor die having a distribution layer | Chien-Ko Liao, Jack Chang Chien, Cheemen Yu, Hem Takiar | 2010-07-27 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2010-06-29 |
| 7615861 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Cheemen Yu, Hem Takiar, Jack Chang Chien, Ning Liu | 2009-11-10 |
| 7592699 | Hidden plating traces | Hem Takiar, Cheemen Yu, Ken Jian Ming Wang, Han-Shiao Chen, Chih-Chin Liao | 2009-09-22 |
| 7538438 | Substrate warpage control and continuous electrical enhancement | Cheemen Yu, Ken Jian Ming Wang, Chih-Chin Liao, Han-Shiao Chen | 2009-05-26 |
| 7485501 | Method of manufacturing flash memory cards | Hem Takiar, Shrikar Bhagath | 2009-02-03 |
| 7435624 | Method of reducing mechanical stress on a semiconductor die during fabrication | Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu | 2008-10-14 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheemen Yu, Hem Takiar | 2008-04-08 |
| 7266888 | Method for fabricating a warpage-preventive circuit board | Chin-Huang Chang, Chung-Lun Liu | 2007-09-11 |
| 7205485 | Printed circuit board and method for fabricating the same | Chin-Huang Chang, Chih-Ming Huang | 2007-04-17 |
| 7102218 | Semiconductor package with chip supporting structure | Jung-Pin Huang, Chin-Thuang Chang | 2006-09-05 |
| 6864434 | Warpage-preventive circuit board and method for fabricating the same | Chin-Huang Chang, Chung-Lun Liu | 2005-03-08 |
| 6835897 | Warpage preventing substrate | Chin-Huang Chang, Cheng-Lun Liu | 2004-12-28 |
| 6737737 | Semiconductor package with chip supporting member | Chin-Huang Chang, Jung-Pin Huang | 2004-05-18 |