Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325881 | Vertical semiconductor device having a stacked die block | Suresh Upadhyayula, Ning Ye, Hem Takiar, Peng Chen | 2019-06-18 |
| 10304816 | Semiconductor device including stacked die with continuous integral via holes | Shiv Shankar Kumar, Honny Chen | 2019-05-28 |
| 10242965 | Semiconductor device including interconnected package on package | Hem Takiar | 2019-03-26 |
| 10236276 | Semiconductor device including vertically integrated groups of semiconductor packages | Yangming Liu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou | 2019-03-19 |
| 10177119 | Fan out semiconductor device including a plurality of semiconductor die | Cong Zhang, Fuqiang Xiao, Bin Xu, Haijun Wu, Zengyu Zhou | 2019-01-08 |
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2018-08-14 |
| 9947606 | Semiconductor device including electromagnetic absorption and shielding | Dacheng Huang, Ye Bai, Kaiyou Qian | 2018-04-17 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu, Cheeman Yu +7 more | 2017-09-26 |
| 9704797 | Waterfall wire bonding | Zhong Lu, Fen Yu, Cheeman Yu, Fuqiang Xiao | 2017-07-11 |
| 9595454 | Semiconductor device including electromagnetic absorption and shielding | Dacheng Huang, Ye Bai, Kaiyou Qian | 2017-03-14 |
| 9362244 | Wire tail connector for a semiconductor device | Cheeman Yu, Hem Takiar | 2016-06-07 |
| 9337153 | EMI shielding and thermal dissipation for semiconductor device | Peng-Fei Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Cheeman Yu +2 more | 2016-05-10 |
| 9331045 | Semiconductor die laminating device with independent drives | Wei Gu, Zhong Lu, Cheeman Yu, En-Yong Tai, Min Ni | 2016-05-03 |
| 9236368 | Semiconductor device including embedded controller die and method of making same | Shiv Shankar Kumar, Kaiyou Qian, Cheeman Yu | 2016-01-12 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2016-01-05 |
| 9230942 | Semiconductor device including alternating stepped semiconductor die stacks | Shiv Shankar Kumar, Dacheng Huang, Zhong Lu, Zhongli Ji | 2016-01-05 |
| 9209159 | Hidden plating traces | Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Han-Shiao Chen, Chih-Chin Liao | 2015-12-08 |
| 9064836 | Extrinsic gettering on semiconductor devices | Shrikar Bhagath, Yuang Zhang, Lu ZHONG, Kaiyou Qian | 2015-06-23 |
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2015-04-14 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2014-11-04 |
| 8878346 | Molded SiP package with reinforced solder columns | Hem Takiar, Hui Liu, Jiang Zhu, Jack Chang-Chien, Cheemen Yu | 2014-11-04 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheemen Yu, Hem Takiar | 2013-07-16 |
| 8482139 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu | 2013-07-09 |
| 8232145 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu | 2012-07-31 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2012-07-10 |